Transistor Outline (TO-226) TO-92; Center Pin Molded to Back 2.54mm

Transistor Outline (TO-226) TO-92; Standard

Transistor Outline (TO-226) TO-92; Center Pin Molded to Back 2.54mm, Side Pins Molded to Forward 1.27mm

Transistor Outline (TO-226) TO-92; Center Pin Molded to Back 1.27mm, Side Pins Molded to Forward 1.27mm

Transistor Outline (TO-226) TO-92; Center Pin Molded to Back 1.27mm, Side Pins Molded to Forward 2.54mm

ATC

ATC 500 S Series BMC Broadband microwave Millimeter-wave 0603 NPO SMT Capacitor

plastic, extremely thin quad flat package; no leads; 8 terminals;body 1.6 x 1.6 x 0.5 mm SOT902-2

Transceiver. 1 x 1 x 0.5 mm - SOT891

M95 is one of the smallest Quad-band GSM/GPRS modules in LCC castellation packaging with the compact size of 19.9 × 23.6 × 2.65mm, ultra low power consumption and extended temperature range. With surface mounted technology, the low profile and small size of LCC package makes M95 easily embedded into the low-volume applications and ensures the reliable connectivity with the applications. This kind of package is ideally suited for large-scale manufacturing which has the strict requirements for cost and efficiency. Built-in unique QuecFOTATM technology allows M95 to update the firmware remotely. Additional features such as integrated TCP/IP protocol stack, serial multiplexer and enhanced AT commands guarantee fast and reliable transmission of data, voice, SMS via GSM/GPRS network and extend the functionality of the application without adding cost. Its tiny size and ultra low power consumption makes M95 a very cost effective and feature-rich platform that is quite suitable for a wide range of M2M applications such as VTS, Industry PDA, Personal Tracking, Wireless POS, Smart Metering and many other M2M applications.

Xilinx

Xilinx FPGA BGA CPG236 Package