MC1630-1

Case style MiniCircuits MC1630-1

Nexperia

DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm

STMicroelectronics

BlueNRG-LP BLUENRG-345MC, BLUENRG-345MT, BLUENRG-355MT - QFN48 package.

DIGI

Digi Xbee Pro S3B 900HP - IPX

Digi

Digi Xbee Pro S3B 900HP

Digikey

Audio power amplifier

Digikey

Audio power amplifier

Torex semiconductor

The DFN 3mm x 3mm package with built-in inductor. Used in DC/DC converters: XCL230, XCL231, XCL225, XCL226. Manufacturer does not provide a detailed 3D-model. Manufacturer package name: DFN3030-10B. The similar DFN package with buil-in inductor is "3X3 uSIP-8" www.3dcontentcentral.com/secure/download-model.aspx?catalogid=171&id=1468616

Vishay

The SiC931 is a synchronous buck regulator module with integrated power MOSFETs and inductor. Its power stage is capable of supplying 20 A continuous current at up to 2 MHz switching frequency. This regulator produces an adjustable output voltage down to 0.6 V from 4.5 V to 18 V input rail to accommodate a variety of applications, including computing, consumer electronics, telecom, and industrial.

MYIR Tech Limited

The MYC-YA157C CPU Module is a compact ST STM32MP1 powered System-on Module (SoM) that combines the STM32MP157 processor (STM32MP157AAC3), 512MB DDR3, 4GB eMMC as well as an integrated GigE PHY chip. A number of peripherals and IO signals are brought out through 1.0 mm pitch 164-pin stamp-hole (Castellated-Hole) expansion interface to make the module an excellent embedded controller for your system integration. Typical applications are industrial control, consumer electronics, smart home, medical and more other energy-efficient applications which require rich performance and low power.